Test Design & Development Services
End-to-End
Inspection & Testing Solutions
Mitigating Risk with Precision Quality Control
Every manufacturing process exhibits a non-zero defect rate. Even with world class manufacturing (100 Defects Per Million Operations / DPMO), a production batch of 1,000 printed circuit boards with 1,000 solder joints each will yield roughly 100 solder defects.
Undetected manufacturing flaws undermine product reliability, increase field failure costs, and delay market entry. By evaluating test accessibility early and deploying targeted inspection methods—such as Automated Optical Inspection (AOI), In-Circuit Testing (ICT), and Flying Probe Testing (FPT)—faults are identified and isolated at the earliest possible stage.
Targeted Defect Capture
Comprehensive coverage across component placement, solder quality, and electrical continuity.
Cost Reduction
Catching assembly errors early minimizes costly rework, field returns, and non-recurring engineering (NRE) expenses.
Optimized Yield
Data-driven test strategies ensure maximum production throughput without compromising quality.
Our Tool-Based Approach to Test Strategy
We combine advanced modeling software with multi-disciplinary engineering to build optimized test strategies customized to your design constraints, production volume, and operating environment.
Advanced DFT Software Tools
TestWay Express®
Focus & Analysis
Combined multi-system test coverage modeling (SPI, AOI, AXI, ICT, FPT, BST).
Key Benefit
Prob access analysis, DPMO estimation, and un-probed net identification.
Corelis Boundary Scan
Focus & Analysis
JTAG/Boundary Scan DFT analysis prior to PCB layout.
Key Benefit
Test supported ICs an interconnected circuits with minimal probe access.
SPEA
Focus & Analysis
Flying Probe Test (FPT) accessibility analysis.
Key Benefit
Delivers board-specific testability reports to optimize probe movement and speed.
End-to-End Inspection & Testing Solutions
Structural & Optical Inspection
Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), Manual Visual Inspection (MVI), and 2D/3D X-Ray.
Electrical & Structural Test
In-Circuit Test (ICT), Manufacturing Defects Analyzer (MDA), Flying Probe Test (FPT), and Boundary Scan (IEEE 1149.1/6).
Functional & RF Testing Development
Custom automated functional test fixtures, LabVIEW/TestStand integration, RF parametric testing and wireless protocol verification (Wi-Fi, Bluetooth, ZigBee, IoT). Full data logging and MES integration.
Environmental & Safety Stress
High-Voltage Insulation & Dielectric Withstand (Hi-Pot), Environmental Stress Screening (ESS), HALT/HASS thermal /vibration profiling, & compliance testing (UL, CSA, VDE, TÜV).
Launch with Excellence to Advanced Production (LEAP)
Our LEAP framework builds DFX, DFT, and VAVE into every phase of the product lifecycle, so manufacturability, testability, and cost are engineered in from the start rather than fixed later.
Stage 1
Planning:
Early DFx & Test Strategy Definition
Stage 2
Alpha Proto:
DFx Review & Post-Build Feedback
Stage 3
Beta Proto:
Post-Build Reports & Preliminary Test Specs(1)
Stage 4
Qualification:
FAI Units, Test Commissioning & Validation(2)
Stage 5
Ramp:
Stable Process & Continuous Yield Optimization(3)
Stage 6
Production:
Full-Scale Manufacturing & Continuous Quality Control
Stage 7
Product End of Life:
Lifecycle Management & End-of-Life Planning
Proven Industry Impact
Aerospace & Defense Complex RF Transceiver
(2) Accelerated a 5+ man-year effort into 11 months. Engineered board-, module-, and system-level RF parametric test racks covering thousands of frequencies to support an aggressive production release schedule.
Medical Device Functional Test System
(3) Implemented full functional testing, 3-axis IMU calibration algorithms, RF range testing, and secure backend database tracking for encrypted radio credentials.
Ready to De-Risk Your Next Product Launch?
Collaborate with our dedicated Test Design & Development Engineering team to optimize test coverage, lower total production costs, and accelerate your time-to-market.